Title :
Analysis of the Vertical Electromagnetic Bandgap Structures in the Power Distribution Network for the Multi-layer Printed Circuit Board
Author :
Yoo, Jeongsik ; Park, Jongbae ; Park, Hyunjeong ; Kim, Junchul ; Shim, Yujeong ; Song, Taigon ; Kim, Joungho
Author_Institution :
Sch. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
Abstract :
In this paper, we demonstrate the suppression of the power distribution network (PDN) impedance in multi-layer Printed Circuit Board (PCB) using Electromagnetic Bandgap (EBG) structure. We, first, analyze the resonances for measured PDN impedance from 8-pairs of power/ground planes by correlation to the 2.5-dimensional field simulation results. Then, we demonstrate and discuss the effect of the EBG structures which are vertically located between the power and ground planes to provide the low impedance within the designed stopband. By comparing the measurement result of the test vehicle with vertical EBG structure to that of the test vehicle without vertical EBG structure, it is shown that, within the EBG stopband, from 11 GHz to 21 GHz, the PDN self impedance, Zl1 of the multi-layer power/ground planes is successfully suppressed.
Keywords :
distribution networks; electric impedance; photonic band gap; printed circuits; 2.5-dimentional field simulation; frequency 11 GHz to 21 GHz; ground plane; impedance; multi-layer printed circuit board; power distribution network; power plane; resonances; stopband; vertical electromagnetic bandgap structure; Automatic testing; Electromagnetic analysis; Impedance measurement; Land vehicles; Metamaterials; Periodic structures; Power measurement; Power systems; Printed circuits; Road vehicles;
Conference_Titel :
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2117-6
Electronic_ISBN :
978-1-4244-2118-3
DOI :
10.1109/EPTC.2008.4763624
