Design of a 3-D SiP for T-DMB with Improvement of Sensitivity and Noise Isolation

Author

Pak, Jiwoo ; Ha, Myunghyun ; Kim, Jaemin ; Kang, Donghee ; Choi, Ho ; Kwon, Seyoung ; La, Keunsoo ; Kim, Joungho

Author_Institution

Dept. of EECS, Terahertz Interconnection & Package Lab., Seoul, South Korea

fYear

2008

fDate

9-12 Dec. 2008

Firstpage

1387

Lastpage

1392

Abstract

SiP (System-in-Package) solution realizes an extremely small sized system which is suitable for mixed-signal mobile applications. However, integration of digital and RF dies with a number of interconnections between them within limited area can cause noise coupling from digital circuits to RF circuits. In this paper, a fully operating T-DMB (Terrestrial Digital Multimedia Broadcasting) system is implemented in a form of a 3-D (three-dimensional) SiP by stacking dies, on which a series of design methodologies to improve the noise isolation level between digital and RF signals, is applied. As a result, the size of system is reduced to 10mm x 10mm, which is the smallest size for full T-DMB system with multimedia, and RF sensitivity is enhanced by 17dB and 45dB for band-3(173-240MHz) and L-band (1.452~1.492GHz), respectively.

Keywords

DRAM chips; digital circuits; mixed analogue-digital integrated circuits; multimedia systems; radiofrequency integrated circuits; system-in-package; L-band; RF die; RF sensitivity; SDRAM die; SiP; T-DMB; bandwidth 1.452 GHz to 1.492 GHz; bandwidth 173 MHz to 240 MHz; digital baseband die; noise isolation level; stacking dies; system-in-package; terrestrial digital multimedia broadcasting system; Circuit noise; Coupling circuits; Design methodology; Digital circuits; Digital multimedia broadcasting; Integrated circuit interconnections; Multimedia systems; Noise level; Radio frequency; Stacking;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th

Conference_Location

Singapore

Print_ISBN

978-1-4244-2117-6

Electronic_ISBN

978-1-4244-2118-3

Type

conf

DOI

10.1109/EPTC.2008.4763625

Filename

4763625