• DocumentCode
    2521329
  • Title

    RF Transceiver Circuit Technology Based Wireless Interconnects for Inter- and Intra-Chip Communication System

  • Author

    Tao, Cheng ; Teemu, Peltonen ; Esa, Tjukanoff ; Tenhunen, Hannu

  • Author_Institution
    Dept. of Inf. Technol., Univ. of Turku, Turku, Finland
  • fYear
    2008
  • fDate
    9-12 Dec. 2008
  • Firstpage
    1409
  • Lastpage
    1414
  • Abstract
    In this work, some most frequently studied interconnect solutions in recent years have been discussed and compared to show their advantages and limitations. RF wireless interconnect (RFWI) method is further studied by system modeling in simulink environment and successful communication between transmitter and receiver is obtained. The results indicate the potential feasibility and reliability of the inter-chip and intra-chip communication system using integrated RF transceiver and antenna to replace the present metal wiring interconnect. The fact that lots of the existing experiences on RF transceiver and antenna design makes RFWI an attractive interconnect solution.
  • Keywords
    antennas; integrated circuit interconnections; radiofrequency integrated circuits; transceivers; RF transceiver circuit; RF wireless interconnect; antenna; inter-chip communication system; intra-chip communication system; metal wiring interconnect; receiver; simulink environment; system modeling; transmitter; CMOS technology; Clocks; Delay; Integrated circuit interconnections; Network-on-a-chip; Optical arrays; Radio frequency; Space technology; Transceivers; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-2117-6
  • Electronic_ISBN
    978-1-4244-2118-3
  • Type

    conf

  • DOI
    10.1109/EPTC.2008.4763628
  • Filename
    4763628