Title :
Flexible High Performance Capacitor on Soft Elastic Material
Author :
Li, H.Y. ; Cheow, L.F. ; Chua, T.T. ; Chua, H.M. ; Lo, G.Q.
Author_Institution :
Inst. of Microelectron., A STAR, Singapore, Singapore
Abstract :
Flexible capacitors have been realized on soft elastic material with the demonstration of good electrical and reliability performance. metal-insulator-metal (MIM) capacitors (~2 pF to ~16 pF) were pre-fabricated by 0.18 ¿m Cu-backend technology on Si-substrate and later transferred onto the soft elastic material (polydimethylsiloxane PDMS) by the wafer-transfer technology. After transfer process development, our results show MIM capacitor can be reliably realized over elastic substrate PDMS. The changing of capacitance is below 0.3 pF for all the capacitors (from 2 pF to 16 pF). The flexible capacitors are still functional when bending radius reach 5.3 cm. At the same time, the changes of capacitance are below 3% at different bending radius.
Keywords :
MIM devices; bending; capacitance; capacitors; elasticity; polymers; reliability; MIM capacitor; bending radius; capacitance; capacitance 16 pF; capacitance 2 pF; flexible capacitors; metal-insulator-metal capacitors; polydimethylsiloxane; radius 5.3 cm; reliability; soft elastic material; wafer-transfer technology; Capacitance; Conductive films; Dielectric substrates; Etching; Fabrication; MIM capacitors; Materials science and technology; Microelectronics; Silicon compounds; Temperature;
Conference_Titel :
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2117-6
Electronic_ISBN :
978-1-4244-2118-3
DOI :
10.1109/EPTC.2008.4763632