Technical Review of Characterization Methods for Thermal Interface Materials (TIM)

Author

Goel, Nitin ; Bhattacharya, A. ; Cervantes, Joseph A. ; Mongia, Rajiv K. ; Machiroutu, Sridhar V. ; Lin, Hau-Lan ; Huang, Ya-Chi ; Fan, Kuang-Cheng ; Denq, Bar-Long ; Liu, Chen-Hua ; Lin, Chun-Hung ; Tien, Chi-Wei ; Pan, Jenq-Haur

Author_Institution

Intel Technol. India Pvt. Ltd., Bengaluru

fYear

2008

fDate

9-12 Dec. 2008

Firstpage

1461

Lastpage

1471

Abstract

There is a need for standard TIM characterization technique for notebook specific applications. The current standard method, ASTM D5470 tester neglects the usage conditions encountered in mobile specific applications. In addition, characterizing "Beginning of Life" performance of TIMs is not sufficient as performance can degrade with usage. This paper emphasizes the importance of considering TIM degradation in mobile applications. Varior TIM characterization approaches prevalent in industry are discussed in this paper. There is also wide disparity in testing methodologies used across industry to evaluate its performance maps with usage. A set of characterization techniques for better TIM evaluation practices are suggested.

Keywords

interface phenomena; reliability; thermal resistance; ASTM D5470 tester; degradation; reliability; thermal interface materials; Contact resistance; Electronic packaging thermal management; Rough surfaces; Surface resistance; Surface roughness; Testing; Thermal conductivity; Thermal degradation; Thermal management; Thermal resistance; ASTM D5470; TIM; Thermal interface material; characterization methods; reliability;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th

Conference_Location

Singapore

Print_ISBN

978-1-4244-2117-6

Electronic_ISBN

978-1-4244-2118-3

Type

conf

DOI

10.1109/EPTC.2008.4763637

Filename

4763637