DocumentCode :
2521495
Title :
Technical Review of Characterization Methods for Thermal Interface Materials (TIM)
Author :
Goel, Nitin ; Bhattacharya, A. ; Cervantes, Joseph A. ; Mongia, Rajiv K. ; Machiroutu, Sridhar V. ; Lin, Hau-Lan ; Huang, Ya-Chi ; Fan, Kuang-Cheng ; Denq, Bar-Long ; Liu, Chen-Hua ; Lin, Chun-Hung ; Tien, Chi-Wei ; Pan, Jenq-Haur
Author_Institution :
Intel Technol. India Pvt. Ltd., Bengaluru
fYear :
2008
fDate :
9-12 Dec. 2008
Firstpage :
1461
Lastpage :
1471
Abstract :
There is a need for standard TIM characterization technique for notebook specific applications. The current standard method, ASTM D5470 tester neglects the usage conditions encountered in mobile specific applications. In addition, characterizing "Beginning of Life" performance of TIMs is not sufficient as performance can degrade with usage. This paper emphasizes the importance of considering TIM degradation in mobile applications. Varior TIM characterization approaches prevalent in industry are discussed in this paper. There is also wide disparity in testing methodologies used across industry to evaluate its performance maps with usage. A set of characterization techniques for better TIM evaluation practices are suggested.
Keywords :
interface phenomena; reliability; thermal resistance; ASTM D5470 tester; degradation; reliability; thermal interface materials; Contact resistance; Electronic packaging thermal management; Rough surfaces; Surface resistance; Surface roughness; Testing; Thermal conductivity; Thermal degradation; Thermal management; Thermal resistance; ASTM D5470; TIM; Thermal interface material; characterization methods; reliability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2117-6
Electronic_ISBN :
978-1-4244-2118-3
Type :
conf
DOI :
10.1109/EPTC.2008.4763637
Filename :
4763637
Link To Document :
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