DocumentCode :
2521592
Title :
Comparison of the effects of nanofiller materials on the dielectric properties of epoxy nanocomposites
Author :
Katayama, J. ; Fuse, N. ; Kozako, M. ; Tanaka, T. ; Ohki, Y.
Author_Institution :
Dept. of Electr. Eng. & Biosci., Waseda Univ., Shinjuku, Japan
fYear :
2011
fDate :
16-19 Oct. 2011
Firstpage :
318
Lastpage :
321
Abstract :
Composites of organic polymers and well-dispersed nm-sized inorganic fillers, called polymer nanocomposites (NCs), have been attracting much attention as new electrical insulating materials. In this paper, experimental results on the typical dielectric properties, namely, complex permittivity (εr\´ and εr"), conductivity, and thermally stimulated depolarization current (TSDC) are evaluated for bisphenol-A epoxy resin and its NCs with boehmite alumina, titania, and silica. The increase in εr\´ and εr" and the magnitudes of the TSDC peaks as well as the increase in conductivity appear more significantly in the NCs with boehmite alumina and titania and less significantly in the NCs with silica than in epoxy resin. This indicates that the silica nanofillers give the best results as far as these properties are concerned. The suppression of molecular motion by the addition of nanofillers seems to work effectively in the case of silica, while the nanofiller addition is likely to accelerate the motion of ionic carriers and/or that of dipoles in the case of boehmite alumina and titania.
Keywords :
dielectric properties; insulating materials; nanocomposites; permittivity; polymers; resins; NCs; TSDC; bisphenol-A epoxy resin; boehmite alumina; complex permittivity; dielectric property; electrical insulating materials; epoxy nanocomposite; ionic carriers; molecular motion; nanofiller material; organic polymers; polymer nanocomposites; silica; thermally stimulated depolarization current; titania; Conductivity; Dielectrics; Epoxy resins; Nanocomposites; Permittivity; Space charge; Temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2011 Annual Report Conference on
Conference_Location :
Cancun
ISSN :
0084-9162
Print_ISBN :
978-1-4577-0985-2
Type :
conf
DOI :
10.1109/CEIDP.2011.6232660
Filename :
6232660
Link To Document :
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