Title :
An integrated circuit for the in situ characterization of CMOS best-process micromachining
Author :
Warneke, Brett ; Pister, Kristofer S J
Author_Institution :
Berkeley Sensor & Actuator Center, California Univ., Berkeley, CA, USA
Abstract :
We have developed an integrated circuit for in situ monitoring and characterization of CMOS post-process micromachining. In our demonstration, the circuit provides automated readout of N-well resistors surrounding each of 140 micromachining test structures at up to 14,000 samples per second per device during the post-process silicon etch. We use this circuit to examine the effect of pit size, surrounding thin film layers, and topography in a 2 μm CMOS process with a XeF 2 post-process step, although the circuit and results are of use to EDP, TMAH, and plasma post-processing
Keywords :
CMOS integrated circuits; etching; integrated circuit design; micromachining; process monitoring; CMOS post-process micromachining; EDP post-processing; N-well resistors; TMAH post-processing; automated readout; in situ characterization; in situ monitoring; integrated circuit development; micromachining test structures; on-chip circuit design; pit design; pit size effect; plasma post-processing; post-process silicon etch; surrounding thin film layers; topography effect; Automatic testing; CMOS integrated circuits; Circuit testing; Etching; Micromachining; Monitoring; Resistors; Silicon; Surfaces; Thin film circuits;
Conference_Titel :
Integrated Circuits and Systems Design, 2000. Proceedings. 13th Symposium on
Conference_Location :
Manaus
Print_ISBN :
0-7695-0843-X
DOI :
10.1109/SBCCI.2000.876051
