• DocumentCode
    2522302
  • Title

    Partial discharge behaviour within two spherical cavities in a dielectric material

  • Author

    Illias, H.A. ; Chen, G. ; Lewin, P.L.

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Malaya, Kuala Lumpur, Malaysia
  • fYear
    2011
  • fDate
    16-19 Oct. 2011
  • Firstpage
    456
  • Lastpage
    459
  • Abstract
    In high voltage insulation systems, a typical defect that exists is a void cavity. It is known that voids are a common source of partial discharge (PD) activity within an insulation system. Research on PD activities within a single void in an insulation material has been widely published. However, studies of PDs within insulation containing multiple voids have not been widely reported. Thus, a simulation model has been developed in this work to attain a better insight of PD events due to multiple voids. Two- and three-dimensional model geometries, which consist of two spherical voids, arranged in different positions with respect to the applied field direction in a dielectric material have been developed using finite element analysis (FEA) software. The models have been used to study the electric field distribution in the voids and PD inception voltage for different distances between the two voids, locations in the material and their respective sizes.
  • Keywords
    dielectric materials; electric fields; finite element analysis; insulating materials; partial discharges; solid modelling; 3D model geometry; FEA; PD inception voltage; dielectric material; electric field distribution; finite element analysis; insulation material; insulation system; partial discharge; spherical void cavity; Cavity resonators; Dielectric materials; Electric fields; Geometry; Insulation; Partial discharges;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2011 Annual Report Conference on
  • Conference_Location
    Cancun
  • ISSN
    0084-9162
  • Print_ISBN
    978-1-4577-0985-2
  • Type

    conf

  • DOI
    10.1109/CEIDP.2011.6232693
  • Filename
    6232693