DocumentCode
2522319
Title
Reliability/wearout-aware design
Author
Stan, Mircea
Author_Institution
Univ. of Virginia, Charlottesville, VA, USA
fYear
2010
fDate
15-18 Aug. 2010
Firstpage
523
Lastpage
523
Abstract
Summary form only given. Reliability and wearout phenomena are becoming first order design constraints in modern ICs. Ignoring wearout at design time can lead to costly early failures in the field, provisioning for wearout through increased margins can lead to overdesign. This presentation will go over several methods that try to: (1) accurately model wearout in order to predict and optimize margin provisioning (2) track wearout and signal imminent failure (3) track wearout and provide closed loop adaptation and (4) even take advantage of wearout in a few special cases.
Keywords
integrated circuit design; integrated circuit reliability; closed loop adaptation; first order design constraint; margin provisioning; reliability; wearout-aware design; Lead; Modems; Reliability engineering;
fLanguage
English
Publisher
ieee
Conference_Titel
Green Computing Conference, 2010 International
Conference_Location
Chicago, IL
Print_ISBN
978-1-4244-7612-1
Type
conf
DOI
10.1109/GREENCOMP.2010.5598272
Filename
5598272
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