• DocumentCode
    2522682
  • Title

    Compatibility evaluation between dielectric breakdown strength and thermal conduction in epoxy/boron-nitride composite

  • Author

    Kurimoto, M. ; Takenaka, Y. ; Murakami, Y. ; Nagao, M.

  • Author_Institution
    Toyohashi Univ. of Technol., Toyohashi, Japan
  • fYear
    2011
  • fDate
    16-19 Oct. 2011
  • Firstpage
    542
  • Lastpage
    545
  • Abstract
    The power module for the electrical vehicle needs electrical insulation material with high thermal conductivity. In this paper, we investigated the compatibility between dielectric breakdown strength and thermal conduction in epoxy/boron-nitride composite, in comparison with epoxy/alumina composite. The breakdown test was carried out under the application of dc lamp voltage and impulse voltage at high temperature. The prepared epoxy/boron-nitride composite was found to have lower dc-breakdown strength than that of the prepared epoxy/alumina composite. On the other hand, the epoxy/boron-nitride composite was higher thermal conductivity, e.g. 11 W/mK, than that of the epoxy/alumina composite, e.g. 4 W/mK In order to compare the breakdown voltage under the condition of the same heat-transfer quantity, we focused the specimens with different thickness whose heat-transfer quantity, e.g. 11 W/K, was the same. Finally, we clarified that the epoxy/boron-nitride composite could have higher breakdown voltage at 140°C than the epoxy/alumina composite with thin thickness under the same heat-transfer quantity in this material condition.
  • Keywords
    alumina; electric breakdown; electric vehicles; epoxy insulation; heat transfer; thermal conductivity; breakdown test; dc impulse voltage; dc lamp voltage; dc-breakdown strength; dielectric breakdown strength; electrical insulation material; electrical vehicle; epoxy-alumina composite; epoxy-boron-nitride composite; heat-transfer quantity; power module; temperature 140 degC; thermal conduction; thermal conductivity; Conductivity; Electric breakdown; Electrodes; Heating; Temperature; Temperature measurement; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2011 Annual Report Conference on
  • Conference_Location
    Cancun
  • ISSN
    0084-9162
  • Print_ISBN
    978-1-4577-0985-2
  • Type

    conf

  • DOI
    10.1109/CEIDP.2011.6232714
  • Filename
    6232714