DocumentCode :
2522967
Title :
An analogy for estimation of dielectric and mechanical strength of insulators at elevated temperature
Author :
Shkolnik, I.E. ; Hiziroglu, Huseyin R.
Author_Institution :
Dept. of Electr. & Comput. Eng., Kettering Univ., Flint, MI, USA
fYear :
2011
fDate :
16-19 Oct. 2011
Firstpage :
599
Lastpage :
602
Abstract :
Various types of insulators working at elevated temperatures provide combination of dielectric and mechanical strength. Based on kinetic nature of strength and nonlinear “stress-strain” dependency of solids, the paper presents an analytical analogy between electrical and mechanical strength as a function of temperature to bridge the gap between fundamental principles and the practical needs. In this study, in particular, polyimide films and polymer concrete insulators are used to describe the “strength-temperature” relationship and predict corresponding values of breakdown voltage. It is shown also the analogy between electrical and mechanical coefficients which determine the influence of structure, rate of loading on dielectric or mechanical strength of insulators. Obtained results are promising for predicting dielectric strength and time-to-failure of insulators by using their properties only at room temperature according to existing standards or experimental data.
Keywords :
electric breakdown; electric strength; polymer films; polymer insulators; reinforced concrete; stress-strain relations; tensile strength; breakdown voltage; electrical coefficients; electrical strength; elevated temperature; insulators dielectric strength estimation; insulators mechanical strength estimation; insulators time-to-failure; mechanical coefficients; nonlinear stress-strain dependency; polyimide films; polymer concrete insulators; strength kinetic nature; strength-temperature relationship; temperature 293 K to 298 K; Concrete; Dielectrics; Electric breakdown; Insulators; Polymers; Solids;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2011 Annual Report Conference on
Conference_Location :
Cancun
ISSN :
0084-9162
Print_ISBN :
978-1-4577-0985-2
Type :
conf
DOI :
10.1109/CEIDP.2011.6232728
Filename :
6232728
Link To Document :
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