DocumentCode
2522980
Title
Analysis of influence of thermal and voltage treatments on silicone/mica electrical insulation by FT-IR ATR
Author
Polanský, R. ; Prosr, P. ; Mentlík, V.
Author_Institution
Univ. of West Bohemia, Pilsen, Czech Republic
fYear
2011
fDate
16-19 Oct. 2011
Firstpage
603
Lastpage
606
Abstract
An influence of thermal and voltage treatments on properties of high-temperature electrical insulating material based on mica and silicone binder was analyzed. Tested material is intended for an operation at extremely high temperatures along with electric field stress. The main aim was to describe the high temperature and electric field influence on the material inner structure. Thermal treatment was simulated by unrepeated thermal stress of 320°C for the time of 500 hours. The material was also exposed to electric field intensities ranging from 9.6 to 15.9 kV/mm for times ranging from 7 to 280 hours. The samples were analyzed via Fourier Transform Infrared Spectroscopy, using the Attenuated Total Reflectance (FT-IR ATR) technique, and also via Microscopic Analysis. According to the measurement, accelerated thermal treatment has no significant effect on the inner structure. On the contrary, voltage treatment causes expressive degradation of the material.
Keywords
Fourier transform spectroscopy; attenuated total reflection; electric fields; heat treatment; infrared spectroscopy; insulation testing; mica; silicone insulation; ATR; FT-IR; Fourier transform infrared spectroscopy; attenuated total reflectance; electric field intensity; electric field stress; electrical insulating material testing; expressive material degradation; material inner structure; mica; microscopic analysis; silicone binder; temperature 320 degC; thermal treatment; time 500 hour; time 7 hour to 280 hour; voltage treatment; Degradation; Insulation; Materials; Microscopy; Principal component analysis; Resistance; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena (CEIDP), 2011 Annual Report Conference on
Conference_Location
Cancun
ISSN
0084-9162
Print_ISBN
978-1-4577-0985-2
Type
conf
DOI
10.1109/CEIDP.2011.6232729
Filename
6232729
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