• DocumentCode
    2523103
  • Title

    Proposal of the polymer chain alignment model

  • Author

    Andritsch, T. ; Kochetov, R. ; Morshuis, P.H.F. ; Smit, J.J.

  • Author_Institution
    Delft Univ. of Technol., Delft, Netherlands
  • fYear
    2011
  • fDate
    16-19 Oct. 2011
  • Firstpage
    624
  • Lastpage
    627
  • Abstract
    Four important models for explaining the properties that are observed in polymer based nanocomposites are the multi-core model, the intensity model, the interphase volume model and the double layer model. This paper outlines a new model, based on those four, which aims to explain certain properties that are considered unique to nanocomposites. The idea behind the polymer chain alignment model is that the material properties of nanocomposites strongly depend on processes prior to and during polymerization. It is assumed that a successful surface modification of nanoparticles leads to the formation of a rigid layer around each nanoparticle with properties differing from both host and filler material. The assumptions taken for the model were correlated with experimental data on epoxy based polymer nanocomposites.
  • Keywords
    filled polymers; nanocomposites; nanoparticles; resins; double layer model; epoxy based polymer nanocomposites; epoxy resin; host and filler material; host material; intensity model; interphase volume model; material properties; multicore model; nanoparticle; polymer chain alignment model; polymerization; Dielectrics; Erbium; Nanocomposites; Permittivity; Polymers; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2011 Annual Report Conference on
  • Conference_Location
    Cancun
  • ISSN
    0084-9162
  • Print_ISBN
    978-1-4577-0985-2
  • Type

    conf

  • DOI
    10.1109/CEIDP.2011.6232734
  • Filename
    6232734