• DocumentCode
    2523264
  • Title

    Dielectric response of various partially cured epoxy nanocomposites

  • Author

    Preda, I. ; Couderc, H. ; Fréchette, M. ; Savoie, S. ; Gao, F. ; Nigmatullin, R. ; Thompson, S. ; Castellon, J.

  • Author_Institution
    Inst. d´´Electron. du Sud, Univ. Montpellier 2, Montpellier, France
  • fYear
    2011
  • fDate
    16-19 Oct. 2011
  • Firstpage
    660
  • Lastpage
    663
  • Abstract
    The purpose of this work is to demonstrate the post-treatment importance using dielectric measurements on nanocomposites. During this post-treatment which is the application of heat over time, crosslinking completes and ageing sets in. Both effects usually take place in the same time. Besides the expected differences between the filled and unfilled epoxy samples, the influence of silane coupling agents and the use of ultrasonic waves on the clay was demonstrated. Since the samples used in the experiment were unusually soft, supposedly because of the insufficient initial curing (4h at 100°C), a total of 38 h of heat treatment was applied, after which an improvement of the mechanical rigidity was noticed. This heat treatment was also considered extremely useful in order to remove humidity from the samples volume. Comparing the results obtained for two samples, with and without the 38h of post treatment, the treated sample was found to have a more stable dielectric response at 20°C.
  • Keywords
    dielectric properties; filled polymers; heat treatment; nanocomposites; resins; ageing sets; dielectric measurements; dielectric response; heat treatment; mechanical rigidity; partially cured epoxy nanocomposites; temperature 100 degC; temperature 20 degC; time 38 h; time 4 h; ultrasonic waves; unfilled epoxy samples; Curing; Dielectric measurements; Dielectrics; Heat treatment; Nanocomposites; Permittivity; Plastics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2011 Annual Report Conference on
  • Conference_Location
    Cancun
  • ISSN
    0084-9162
  • Print_ISBN
    978-1-4577-0985-2
  • Type

    conf

  • DOI
    10.1109/CEIDP.2011.6232743
  • Filename
    6232743