DocumentCode
2523275
Title
Improving partial discharge resistance of hydrophobic epoxy resins with nano-filler dispersion
Author
Yamazaki, Kinya ; Cho, Hyeonwoo ; Imai, Tetsuro ; Sekiya, Hiroo ; Ozaki, Takashi ; Tanaka, Mitsuru ; Asayama, M. ; Osako, T.
Author_Institution
Power & Ind. Syst. R&D Center, Toshiba Corp., Fuchu, Japan
fYear
2011
fDate
16-19 Oct. 2011
Firstpage
668
Lastpage
671
Abstract
Outdoor insulation needs materials with weather resistant properties that are superior to those of other insulating materials such as epoxy resins. Silicone rubbers are widely used in these applications, but they are more expensive than other insulating materials. Recently, many studies have been conducted on polymer nanocomposites. We have also demonstrated that nano-filler dispersion improves the insulation properties of epoxy resin. This paper focuses on hydrophobic epoxy resins with the alicyclic group to obtain properties essential for outdoor insulating materials. We prepared hydrophobic epoxy-based nanocomposites containing nano-fillers, and measured the erosion depth and contact angle in order to evaluate their partial discharge resistance and hydrophobicity, respectively. We thus confirmed that the erosion caused by partial discharge was suppressed to less than half with the addition of 5 wt% titanium dioxide or layered silicate. Furthermore, the hydrophobicity of nanocomposite was maintained at a similar level to those of unexposed samples and the contact angle was about 100-110° before and after exposure.
Keywords
contact angle; epoxy insulation; filled polymers; hydrophobicity; nanocomposites; partial discharges; alicyclic group; contact angle; erosion depth; hydrophobic epoxy based nanocomposites; hydrophobic epoxy resins; hydrophobicity; nanofiller dispersion; outdoor insulation; partial discharge resistance; Annealing; Insulation; Nanocomposites; Resistance; Rough surfaces; Surface morphology; Surface roughness;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena (CEIDP), 2011 Annual Report Conference on
Conference_Location
Cancun
ISSN
0084-9162
Print_ISBN
978-1-4577-0985-2
Type
conf
DOI
10.1109/CEIDP.2011.6232745
Filename
6232745
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