• DocumentCode
    2523761
  • Title

    Via-aware global routing for good VLSI manufacturability and high yield

  • Author

    Yang, Yang ; Jing, Tong ; Hong, Xianlong ; Hu, Yu ; Zhu, Qi ; Hu, Xiaodong ; Yan, Guiying

  • Author_Institution
    Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
  • fYear
    2005
  • fDate
    23-25 July 2005
  • Firstpage
    198
  • Lastpage
    203
  • Abstract
    CAD tools have become more and more important for integrated circuit (IC) design since a complicated system can be designed into a single chip, called system-on-a-chip (SOC), in which physical design tool is an essential and critical part. We try to consider the via minimization problem as early as possible in physical design. We propose a routing method focusing on minimizing vias while considering mutability and wire-length constraint. That is, in the global routing phase, we minimize the number of bends, which is closely related to the number of vias. Previous work only dealt with very small nets, but our algorithm is general for the nets with any size. Experimental results show that our algorithm can greatly reduce the count of bends for various sizes of nets while meeting the constraints of congestion and wire-length.
  • Keywords
    VLSI; circuit CAD; design for manufacture; integrated circuit design; integrated circuit manufacture; integrated circuit yield; network routing; system-on-chip; CAD tool; VLSI manufacturability; congestion constraint; integrated circuit design; physical design tool; system-on-a-chip; via minimization problem; via-aware global routing; wire-length constraint; Circuit optimization; Computer aided manufacturing; Computer science; Content addressable storage; Design automation; Integrated circuit technology; Minimization; Routing; System-on-a-chip; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Application-Specific Systems, Architecture Processors, 2005. ASAP 2005. 16th IEEE International Conference on
  • ISSN
    2160-0511
  • Print_ISBN
    0-7695-2407-9
  • Type

    conf

  • DOI
    10.1109/ASAP.2005.67
  • Filename
    1540386