DocumentCode :
252378
Title :
A prototype force sensing unit for a capacitive-type force-torque sensor
Author :
Somlor, S. ; Schmitz, A. ; Hartanto, R.S. ; Sugano, S.
Author_Institution :
Sugano Lab., Waseda Univ., Tokyo, Japan
fYear :
2014
fDate :
13-15 Dec. 2014
Firstpage :
684
Lastpage :
689
Abstract :
Force sensing is a crucial task for robots, especially when the end effectors such as fingers and hands need to interact with an unknown environment, for example in a humanoid robot. In order to sense such forces, a force/torque sensor is an essential component. Many available force/torque sensors are based on strain gauges, but other sensing principles are also possible. In this paper we describe steps towards a capacitive type based sensor. Several MEMS capacitive sensors are described in the literature; however very few larger sensors are available, as capacitive sensors usually have disadvantages such as severe hysteresis and temperature sensitivity. On the other hand, capacitive sensors have the advantage of the availability of small sized chips for sensor readout and digitization. We employ copper beryllium for the transducer, which has been modified from the ones described in the literature to be able to be used in a small sized, robust force/torque sensor. Therefore, as the first step toward the goal of building such a sensor, in this study we have created a prototype sensing unit and have tested its sensitivity. No viscoelastic materials are used for the sensing unit, which usually introduce severe hysteresis in capacitive sensors. We have achieved a high signal-to-noise ratio, high sensitivity and a range of 10 Newton.
Keywords :
beryllium alloys; capacitive sensors; copper alloys; force sensors; microsensors; prototypes; readout electronics; torque measurement; transducers; CuBe; MEMS capacitive sensors; capacitive-type force-torque sensor; copper beryllium; prototype force sensing unit; sensor readout; signal-to-noise ratio; transducer; Copper; Force; Robot sensing systems; Sensitivity; Temperature measurement; Temperature sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
System Integration (SII), 2014 IEEE/SICE International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4799-6942-5
Type :
conf
DOI :
10.1109/SII.2014.7028121
Filename :
7028121
Link To Document :
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