Title :
Testing a multichip package for a consumer communications application
Author :
Biewenga, Alex ; Muris, Math ; Schuttert, Rodger ; Fawer, Urs
Author_Institution :
Philips Electron. Design & Tools, Eindhoven, Netherlands
Abstract :
A multichip package was developed to meet the market requirements for an advanced wireless telephone handset. The successful testing process of this multichip package, comprising test requirements, test strategy, test development and results from the production test is presented. A wireless telephone handset, containing the multichip package is currently in high volume production within Philips
Keywords :
consumer electronics; cordless telephone systems; integrated circuit testing; mobile communication; multichip modules; production testing; telecommunication equipment testing; Philips; consumer communications; high volume production; multichip package; production test; test strategy; wireless telephone handset; Electronics packaging; Flash memory; Integrated circuit testing; Microprocessors; Production; Semiconductor device packaging; Software testing; Telephone sets; Telephony; Time to market;
Conference_Titel :
Test Conference, 1998. Proceedings., International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-5093-6
DOI :
10.1109/TEST.1998.743155
