DocumentCode
2524559
Title
Fine pitch (45 micron) P4 probing
Author
Ishii, Toshinori ; Yoshida, Hideaki
Author_Institution
Mitsubishi Mater. Corp., Hyogo, Japan
fYear
1998
fDate
18-23 Oct 1998
Firstpage
272
Lastpage
276
Abstract
We describe the P4 (photolithographic pattern plating process) probe card. This technology has enabled very fine (45 micron) pitch, high pin count (more than 1000 pins) and high speed (>2 GHz) probing. We summarize the design, the manufacturing process, standard specifications and performance properties of the P4 probe card. The results of contact tests are also described
Keywords
chip scale packaging; electroplating; fine-pitch technology; integrated circuit testing; lead bonding; photolithography; production testing; 45 micron; HF performance; P4 probe card; contact tests; fine pitch P4 probing; high pin count; high speed probing; manufacturing process; performance properties; photolithographic pattern plating process; standard specifications; wire bonding; Assembly; Clamps; Contacts; Joining processes; Manufacturing processes; Nickel alloys; Probes; Process design; Testing; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1998. Proceedings., International
Conference_Location
Washington, DC
ISSN
1089-3539
Print_ISBN
0-7803-5093-6
Type
conf
DOI
10.1109/TEST.1998.743163
Filename
743163
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