DocumentCode
2524583
Title
An introduction to area array probing
Author
Taber, Frederick L., Jr.
Author_Institution
IBM Corp., USA
fYear
1998
fDate
18-23 Oct 1998
Firstpage
277
Lastpage
281
Abstract
The semiconductor industry´s move to area array I/O wafers is accelerating, demanding that wafer probe professionals become knowledgeable with the considerations and techniques for probing these wafers. Area array probing has been practised within ISM for over two decades. From that experience, this overview will provide an awareness of the factors, techniques and methods associated with array area probing
Keywords
ceramic packaging; chip scale packaging; integrated circuit testing; production testing; reflow soldering; reviews; COBRA probe; area array I/O wafers; area array probing; ceramic package; pin grid array; reflow solder bump; vertical probe market growth; wafer probes; Acceleration; Ceramics; Circuits; History; Packaging; Probes; Semiconductor device manufacture; Space technology; Testing; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1998. Proceedings., International
Conference_Location
Washington, DC
ISSN
1089-3539
Print_ISBN
0-7803-5093-6
Type
conf
DOI
10.1109/TEST.1998.743164
Filename
743164
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