• DocumentCode
    2524608
  • Title

    A structured and scalable mechanism for test access to embedded reusable cores

  • Author

    Marinissen, Erik Jan ; Arendsen, Robert ; Bos, Gerard ; Dingemanse, Hans ; Lousberg, M. ; Wouters, Clemens

  • Author_Institution
    VLSI Design Autom. & Test, Philips Res. Lab., Eindhoven, Netherlands
  • fYear
    1998
  • fDate
    18-23 Oct 1998
  • Firstpage
    284
  • Lastpage
    293
  • Abstract
    The main objective of core-based IC design is improvement of design efficiency and time-to-market. In order to prevent test development from becoming the bottleneck in the entire development trajectory, reuse of pre-computed tests for the reusable pre-designed cores is mandatory. The core user is responsible for translating the test at core level into a test at chip level. A standardized test access mechanism eases this task, therefore contributing to the plug-n-play character of core-based design. This paper presents the concept of a structured test access mechanism for embedded cores. Reusable IP modules are wrapped in a TESTSHELL. Test data access from chip pins to TESTSHELL and vice versa is provided by the TESTRAIL, while the operation of the TESTSHELL is controlled by a dedicated test control mechanism (TCM). Both TESTRAIL as well as TCM are standardized, but open for extensions
  • Keywords
    automatic testing; design for testability; embedded systems; integrated circuit testing; modules; TCM; TESTRAIL; TESTSHELL; core-based desig; dedicated test control; embedded reusable cores; plug-n-play character; pre-computed tests; reusable IP modules; reusable pre-designed cores; scalable mechanism; standardized test access; structured mechanism; structured test; Automatic testing; Circuit testing; Integrated circuit testing; Intellectual property; Laboratories; Pins; Process design; Semiconductor device testing; System testing; Time to market;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 1998. Proceedings., International
  • Conference_Location
    Washington, DC
  • ISSN
    1089-3539
  • Print_ISBN
    0-7803-5093-6
  • Type

    conf

  • DOI
    10.1109/TEST.1998.743166
  • Filename
    743166