DocumentCode
252474
Title
Final program USB
fYear
2014
fDate
6-9 Oct. 2014
Firstpage
1
Lastpage
14
Abstract
The following topics are dealt with: SOI platforms; subthreshold analog and RF; FinFET; subthreshold digital; monolithic 3D integration; FDSOI technology; subthreshold low voltage devices; SOI circuit design; SOI structures; subthreshold energy harvesting for low power circuits; SOI substrates; subthreshold radiation effects on low voltage circuits; and MEMS.
Keywords
MOSFET; energy harvesting; integrated circuit design; low-power electronics; micromechanical devices; radiation effects; radiofrequency integrated circuits; silicon-on-insulator; three-dimensional integrated circuits; FDSOI technology; FinFET; MEMS; RF system; SOI circuit design; SOI platforms; SOI structures; SOI substrates; low power circuits; low voltage circuits; monolithic 3D integration; subthreshold analog system; subthreshold digital system; subthreshold energy harvesting; subthreshold low voltage devices; subthreshold radiation effects;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2014 IEEE
Conference_Location
Millbrae, CA
Type
conf
DOI
10.1109/S3S.2014.7028179
Filename
7028179
Link To Document