DocumentCode
2524742
Title
A new boron diffusion model incorporating the dislocation loop growth
Author
Uwasawa, K. ; Uchida, T. ; Ikezawa, T. ; Hane, M. ; Matsuki, T. ; Kato, H. ; Ishida, K.
Author_Institution
Microelectron. Res. Labs., NEC Corp., Sagamihara, Japan
fYear
1994
fDate
11-14 Dec. 1994
Firstpage
873
Lastpage
876
Abstract
A new simulation model for boron redistribution incorporating the dislocation loop growth during the post implantation annealing, is proposed. Modeling the capture of point defects and boron-interstitial silicon pair (BI) by the loop allows both the loop growth and the redistribution to be predicted simultaneously and self-consistently, on the basis of non-equilibrium BI diffusion kinetics. The physically based model, using reasonable parameters, reproduces the boron redistribution under various experimental conditions, including the results of non-equilibrium diffusion in very short time annealing after the ion implantation process.<>
Keywords
MOS integrated circuits; ULSI; annealing; boron; diffusion; dislocation loops; elemental semiconductors; ion implantation; point defects; semiconductor process modelling; silicon; MOSFETs; Si:B; ULSI fabrication; boron redistribution; boron-interstitial silicon pair; diffusion model; dislocation loop growth; ion implantation process; nonequilibrium BI diffusion kinetics; physically based model; point defects; post implantation annealing; simulation model; Bismuth; Boron; Fabrication; Kinetic theory; MOSFETs; Microelectronics; National electric code; Rapid thermal annealing; Silicon; Simulated annealing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1994. IEDM '94. Technical Digest., International
Conference_Location
San Francisco, CA, USA
ISSN
0163-1918
Print_ISBN
0-7803-2111-1
Type
conf
DOI
10.1109/IEDM.1994.383274
Filename
383274
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