• DocumentCode
    2524742
  • Title

    A new boron diffusion model incorporating the dislocation loop growth

  • Author

    Uwasawa, K. ; Uchida, T. ; Ikezawa, T. ; Hane, M. ; Matsuki, T. ; Kato, H. ; Ishida, K.

  • Author_Institution
    Microelectron. Res. Labs., NEC Corp., Sagamihara, Japan
  • fYear
    1994
  • fDate
    11-14 Dec. 1994
  • Firstpage
    873
  • Lastpage
    876
  • Abstract
    A new simulation model for boron redistribution incorporating the dislocation loop growth during the post implantation annealing, is proposed. Modeling the capture of point defects and boron-interstitial silicon pair (BI) by the loop allows both the loop growth and the redistribution to be predicted simultaneously and self-consistently, on the basis of non-equilibrium BI diffusion kinetics. The physically based model, using reasonable parameters, reproduces the boron redistribution under various experimental conditions, including the results of non-equilibrium diffusion in very short time annealing after the ion implantation process.<>
  • Keywords
    MOS integrated circuits; ULSI; annealing; boron; diffusion; dislocation loops; elemental semiconductors; ion implantation; point defects; semiconductor process modelling; silicon; MOSFETs; Si:B; ULSI fabrication; boron redistribution; boron-interstitial silicon pair; diffusion model; dislocation loop growth; ion implantation process; nonequilibrium BI diffusion kinetics; physically based model; point defects; post implantation annealing; simulation model; Bismuth; Boron; Fabrication; Kinetic theory; MOSFETs; Microelectronics; National electric code; Rapid thermal annealing; Silicon; Simulated annealing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1994. IEDM '94. Technical Digest., International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-2111-1
  • Type

    conf

  • DOI
    10.1109/IEDM.1994.383274
  • Filename
    383274