DocumentCode :
2524762
Title :
A continuous and general model for boron diffusion during post-implant annealing including damaged and amorphizing conditions
Author :
Baccus, B. ; Vandenbossche, E.
Author_Institution :
IEMN-ISEN, Lille, France
fYear :
1994
fDate :
11-14 Dec. 1994
Firstpage :
869
Lastpage :
872
Abstract :
A model has been developed for boron diffusion after ion implantation and validated for a very wide range of doses and temperatures. For the first time, it allows the continuous simulation of the transition between amorphizing and non-amorphizing conditions. Transient-enhanced diffusion (TED) and activation are modeled by taking into account the implant damage and precipitation kinetics. It is shown that the initial level of activation is one of the most important parameters in such an analysis.<>
Keywords :
BiCMOS integrated circuits; annealing; boron; diffusion; elemental semiconductors; ion implantation; precipitation; semiconductor process modelling; silicon; Si:B; amorphizing conditions; boron diffusion; dose ranges; dose temperatures; implant damage; nonamorphizing conditions; post-implant annealing; precipitation kinetics; transient-enhanced diffusion; Annealing; Bismuth; Boron; Electric variables measurement; Furnaces; Implants; Ion implantation; Kinetic theory; Semiconductor process modeling; Temperature distribution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1994. IEDM '94. Technical Digest., International
Conference_Location :
San Francisco, CA, USA
ISSN :
0163-1918
Print_ISBN :
0-7803-2111-1
Type :
conf
DOI :
10.1109/IEDM.1994.383275
Filename :
383275
Link To Document :
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