Title :
A continuous and general model for boron diffusion during post-implant annealing including damaged and amorphizing conditions
Author :
Baccus, B. ; Vandenbossche, E.
Author_Institution :
IEMN-ISEN, Lille, France
Abstract :
A model has been developed for boron diffusion after ion implantation and validated for a very wide range of doses and temperatures. For the first time, it allows the continuous simulation of the transition between amorphizing and non-amorphizing conditions. Transient-enhanced diffusion (TED) and activation are modeled by taking into account the implant damage and precipitation kinetics. It is shown that the initial level of activation is one of the most important parameters in such an analysis.<>
Keywords :
BiCMOS integrated circuits; annealing; boron; diffusion; elemental semiconductors; ion implantation; precipitation; semiconductor process modelling; silicon; Si:B; amorphizing conditions; boron diffusion; dose ranges; dose temperatures; implant damage; nonamorphizing conditions; post-implant annealing; precipitation kinetics; transient-enhanced diffusion; Annealing; Bismuth; Boron; Electric variables measurement; Furnaces; Implants; Ion implantation; Kinetic theory; Semiconductor process modeling; Temperature distribution;
Conference_Titel :
Electron Devices Meeting, 1994. IEDM '94. Technical Digest., International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-2111-1
DOI :
10.1109/IEDM.1994.383275