• DocumentCode
    2524861
  • Title

    Switch-level bridging fault simulation in the presence of feedbacks

  • Author

    Dahlgren, Peter

  • Author_Institution
    Dept. of Comput. Eng., Chalmers Univ. of Technol., Goteborg, Sweden
  • fYear
    1998
  • fDate
    18-23 Oct 1998
  • Firstpage
    363
  • Lastpage
    371
  • Abstract
    This paper investigates the degradation in detectability of bridging faults caused by situations of active feedback and logically unresolvable intermediate values under different fault modeling assumptions. A bridging fault simulator is presented that is based on a combination of switch-level modeling and levelized logic simulation. Levelized simulation is efficient for fault propagation and feedback analysis, whereas the switch-level model is used for determining whether an intermediate value is logically resolvable. A method to extract the logic function of channel graphs is presented in order to perform levelized processing of switch-level networks. The experimental results show that active feedback may reduce fault coverage by as much as 9% for stuck-at test sets and realistic bridging fault sets
  • Keywords
    CMOS logic circuits; VLSI; circuit feedback; discrete event simulation; fault simulation; integrated circuit modelling; logic simulation; logic testing; short-circuit currents; CMOS gates; VLSI testability; active feedback; channel graphs; degradation in detectability; event-driven simulation; fault modeling assumptions; fault propagation; feedback analysis; levelized logic simulation; logic function extraction; logically unresolvable intermediate values; region of logic uncertainty; stuck-at test sets; switch-level bridging fault simulation; switch-level modeling; Bridge circuits; Circuit faults; Circuit testing; Computational modeling; Discrete event simulation; Feedback circuits; Feedback loop; Logic testing; Semiconductor device modeling; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 1998. Proceedings., International
  • Conference_Location
    Washington, DC
  • ISSN
    1089-3539
  • Print_ISBN
    0-7803-5093-6
  • Type

    conf

  • DOI
    10.1109/TEST.1998.743175
  • Filename
    743175