• DocumentCode
    2525070
  • Title

    AlN/GaN MISFET for high frequency applications: Physical simulation and experimental evaluation

  • Author

    Seo, Sanghyun ; Ghose, Kaustav ; Pavlidis, Dimitris ; Schmidt, Stefan

  • Author_Institution
    Darmstadt Univ. of Technol., Darmstadt
  • fYear
    2007
  • fDate
    8-10 Oct. 2007
  • Firstpage
    219
  • Lastpage
    222
  • Abstract
    AIN/GaN metal insulator semiconductor field effect transistors (MISFETs) were designed, simulated and fabricated. DC and S-parameter measurements were also performed. Drift-diffusion simulations using DESSIS compared AIN/GaN MISFETs and A32Ga68N/GaN Heterostructure FETs (HFETs) with the same geometries. The simulation results show the advantages of AIN/GaN MISFETs in terms of higher saturation current, lower gate leakage and higher transconductance than AlGaN HFETs. First results from fabricated AIN/GaN devices with 1.1 mum gate length and 200 mum gate width showed a maximum drain current density of ~-470 mA/mm and a peak extrinsic transconductance of 80 mS/mm. S-parameter measurements showed that the current-gain cutoff frequency (fT) and maximum oscillation frequency (fmax) were 2.8 GHz and 10.3 GHz, respectively. To the authors knowledge this is the first report of a systematic study of AIN/GaN MISFETs addressing their physical modeling and experimental high-frequency characteristics.
  • Keywords
    III-V semiconductors; MISFET; S-parameters; aluminium compounds; current density; gallium compounds; microwave transistors; AlN-GaN; MISFET; S-parameter measurements; current density; drift-diffusion simulation; frequency 10.3 GHz; frequency 2.8 GHz; gate leakage; heterostructure FET; metal insulator semiconductor field effect transistors; size 1.1 mum; size 200 mum; transconductance; Cutoff frequency; FETs; Gallium nitride; HEMTs; Insulation; MISFETs; MODFETs; Metal-insulator structures; Scattering parameters; Transconductance; AlGaN/GaN HFETs; AlN; AlN/GaN MISFETs; DESSIS; Drift-diffusion simulation; Index Terms;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Integrated Circuit Conference, 2007. EuMIC 2007. European
  • Conference_Location
    Munich
  • Print_ISBN
    978-2-87487-002-6
  • Type

    conf

  • DOI
    10.1109/EMICC.2007.4412688
  • Filename
    4412688