DocumentCode
2525307
Title
Thermomechanical factors in molybdenum field emitter operation and failure
Author
Ancona, M.G.
Author_Institution
Naval Res. Lab., Washington, DC, USA
fYear
1994
fDate
11-14 Dec. 1994
Firstpage
803
Lastpage
806
Abstract
A thermomechanical analysis of many of the basic effects which might be expected to play a role in field emitter array breakdown is given. We find that of the "intrinsic" factors considered only the large Maxwell stresses induced by the electric field might possibly lead to failure. Direct thermal effects are always insignificant. Failure modes associated with "extrinsic" phenomena such as arcing or from tip "imperfections" such as grain boundaries have not been studied and these may also be important.<>
Keywords
molybdenum; semiconductor device reliability; stress effects; vacuum microelectronics; Mo; arcing; direct thermal effects; electric field; failure; failure modes; field emitter array breakdown; grain boundaries; intrinsic factors; large Maxwell stresses; molybdenum field emitter operation; thermomechanical analysis; thermomechanical factors; Electric breakdown; Equations; Field emitter arrays; Finite element methods; Geometry; Laboratories; Temperature; Thermal conductivity; Thermal stresses; Thermomechanical processes;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1994. IEDM '94. Technical Digest., International
Conference_Location
San Francisco, CA, USA
ISSN
0163-1918
Print_ISBN
0-7803-2111-1
Type
conf
DOI
10.1109/IEDM.1994.383302
Filename
383302
Link To Document