DocumentCode :
2525316
Title :
Micro-sensor for foot pressure measurement
Author :
Wahab, Yufridin ; Zayegh, Aladin ; Veljanovski, Ronny ; Begg, Rezaul K.
Author_Institution :
Sch. of Electr. Eng., Victoria Univ., Melbourne, VIC
fYear :
2008
fDate :
19-21 Nov. 2008
Firstpage :
1
Lastpage :
5
Abstract :
The measurement of interface pressure between the foot and shoe is important in gait analysis and other health diagnosis. Abnormal pressure may indicate instability in gait, risks of ulceration development especially in diabetic foot as well as have many other biomedical diagnostic applications. However, the currently available foot pressure sensors show a number of weaknesses that limit their performance in the measurement of foot plantar pressure. This paper reports the design and analysis of a MEMS-based pressure sensor customized for foot pressure measurement. The maximum pressure measurement can be up to 2-MPa with high linearity across the proposed pressure range. These optimized characteristics show excellent potential for the sensorpsilas suitability for pressure measurement in a wide spectrum of biomechanical activities.
Keywords :
bioMEMS; biomedical equipment; biomedical measurement; footwear; gait analysis; microsensors; patient diagnosis; pressure measurement; pressure sensors; risk analysis; wounds; MEMS-based pressure sensor; biomechanical activities; biomedical diagnostics; biomedical measurement; diabetic foot; foot plantar pressure measurement; foot-to-shoe interface pressure measurement; gait analysis; health diagnosis; microsensor; pressure 2 MPa; ulceration development risks; Biomedical measurements; Biosensors; Diabetes; Foot; Hysteresis; Linearity; Micromechanical devices; Pressure measurement; Sensor arrays; Sensor phenomena and characterization; biomechanics; biomedical equipment; gait assessment; pressure measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
TENCON 2008 - 2008 IEEE Region 10 Conference
Conference_Location :
Hyderabad
Print_ISBN :
978-1-4244-2408-5
Electronic_ISBN :
978-1-4244-2409-2
Type :
conf
DOI :
10.1109/TENCON.2008.4766444
Filename :
4766444
Link To Document :
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