Title :
Failure mechanisms and fault classes for CMOS-compatible microelectromechanical systems
Author :
Castillejo, A. ; Veychard, D. ; Mir, S. ; Karam, J.M. ; Courtois, B.
Author_Institution :
TIMA Lab., Grenoble, France
Abstract :
Silicon-compatible micromachining provides a low cost monolithic solution for the integration of microelectromechanical systems (MEMS). In the last years, CMP (the French MultiProject Wafer Service) has made available technological solutions for the fabrication of CMOS-compatible MEMS. Numerous monolithic devices have been fabricated using this service. The inspection of failed devices has allowed the identification of the most typical failure mechanisms and design errors for this type of MEMS. This valuable information, together with a detailed analysis of the fabrication processes, is used in this paper to provide a classification of faults in silicon-compatible MEMS which can later be used for fault simulation and testing
Keywords :
CMOS integrated circuits; elemental semiconductors; failure analysis; fault simulation; integrated circuit testing; micromechanical devices; silicon; CMOS-compatible MEMS; CMP; French MultiProject Wafer Service; Si; Si compatible micromachining; Si-SiO2; classification of faults; design errors; fabrication; failed devices; failure mechanisms; fault simulation; fault testing; identification; microelectromechanical systems; monolithic solution; physical modelling; CMOS technology; Computer errors; Costs; Fabrication; Failure analysis; Information analysis; Inspection; Microelectromechanical systems; Micromachining; Micromechanical devices;
Conference_Titel :
Test Conference, 1998. Proceedings., International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-5093-6
DOI :
10.1109/TEST.1998.743197
