DocumentCode :
2525377
Title :
MEMS fault model generation using CARAMEL
Author :
Kolpekwar, Abhijeet ; Kellen, Chris ; Blanton, R.D.
Author_Institution :
Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
fYear :
1998
fDate :
18-23 Oct 1998
Firstpage :
557
Lastpage :
566
Abstract :
We have enhanced the process simulator CODEF (1996) into a tool called CARAMEL (Contamination And Reliability Analysis of MicroElectromechanical Layout) for analyzing the impact of contamination particles on the geometrical and material properties of microelectromechanical systems (MEMS). CARAMEL accepts as input a microelectromechanical layout, a particulate description, and a process recipe. CARAMEL produces a mesh description of the defective layout that is completely compatible with the electromechanical simulator ABAQUS (1995). Analysis of CARAMEL´s output indicates that a wide range of defective structures are possible due to the presence of contaminations. Moreover, electromechanical simulations of CARAMEL´s mesh representations of defective layout has revealed that a wide variety of faulty behaviors are associated with these defects. In this paper, we describe CARAMEL and its application to the development of realistic fault models for MEMS
Keywords :
circuit simulation; digital simulation; failure analysis; fault diagnosis; integrated circuit reliability; integrated circuit testing; micromechanical devices; CARAMEL; MEMS fault model; contamination particles; defective layout; electromechanical simulator ABAQUS; geometrical properties; material properties; mesh description; microelectromechanical systems; process simulator CODEF; reliability analysis; Analytical models; Atmospheric modeling; Contamination; Design for testability; Fabrication; Materials reliability; Microelectromechanical systems; Micromechanical devices; Solid modeling; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Conference, 1998. Proceedings., International
Conference_Location :
Washington, DC
ISSN :
1089-3539
Print_ISBN :
0-7803-5093-6
Type :
conf
DOI :
10.1109/TEST.1998.743199
Filename :
743199
Link To Document :
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