Plasma cleaning for plastic ball grid array (PBGA): a study on surface cleanliness, wire bondability and adhesion

Author

Lee, Charles ; Tan Check-Eng, R. ; Ong Wai-Lian, J. ; Gopalakrishnan, R. ; Nyunt, Khine ; Wong, Andrew

Author_Institution

Dept. of Packaging Technol., Siemens Components Pte Ltd., Singapore

fYear

1997

fDate

21-25 Jul 1997

Firstpage

50

Lastpage

55

Abstract

An investigation of O₂, Ar and Ar/H₂ plasma cleaning was carried out on PBGA substrates to study its effects on surface cleanliness, wire bondability and moulding compound/solder mask adhesion. Optimisation of the plasma parameters was achieved using the contact angle method and verified by AES, XPS and wedge pull test. Generally, it was noted that the wedge bond quality and moisture sensitivity of a 225 I/O PBGA were improved after plasma cleaning. Furthermore, AFM characterization revealed that the solder mask has undergone plasma induced surface modification. Cross-contamination of Au and F traces on the solder mask which has occurred during plasma cleaning was analysed by XPS. Results from this study have demonstrated the benefits and consequences of plasma cleaning for PBGA

Keywords

Auger effect; X-ray photoelectron spectra; adhesion; atomic force microscopy; integrated circuit packaging; lead bonding; masks; moisture; plasma applications; plastic packaging; substrates; surface cleaning; surface contamination; AES; AFM characterization; Ar; Ar-H₂; Au; Au traces; F; F traces; H₂; O₂; PBGA substrates; XPS; contact angle method; cross-contamination; moisture sensitivity; moulding compound adhesion; plasma cleaning; plasma induced surface modification; plasma parameters optimisation; plastic BGA; plastic ball grid array; solder mask adhesion; surface cleanliness; wedge bond quality; wedge pull test; wire bondability; Adhesives; Argon; Bonding; Cleaning; Electronics packaging; Optimization methods; Plasmas; Plastics; Testing; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical & Failure Analysis of Integrated Circuits, 1997., Proceedings of the 1997 6th International Symposium on

Print_ISBN

0-7803-3985-1

Type

conf

DOI

10.1109/IPFA.1997.638120

Filename

638120