Title :
Plasma cleaning for plastic ball grid array (PBGA): a study on surface cleanliness, wire bondability and adhesion
Author :
Lee, Charles ; Tan Check-Eng, R. ; Ong Wai-Lian, J. ; Gopalakrishnan, R. ; Nyunt, Khine ; Wong, Andrew
Author_Institution :
Dept. of Packaging Technol., Siemens Components Pte Ltd., Singapore
Abstract :
An investigation of O2, Ar and Ar/H2 plasma cleaning was carried out on PBGA substrates to study its effects on surface cleanliness, wire bondability and moulding compound/solder mask adhesion. Optimisation of the plasma parameters was achieved using the contact angle method and verified by AES, XPS and wedge pull test. Generally, it was noted that the wedge bond quality and moisture sensitivity of a 225 I/O PBGA were improved after plasma cleaning. Furthermore, AFM characterization revealed that the solder mask has undergone plasma induced surface modification. Cross-contamination of Au and F traces on the solder mask which has occurred during plasma cleaning was analysed by XPS. Results from this study have demonstrated the benefits and consequences of plasma cleaning for PBGA
Keywords :
Auger effect; X-ray photoelectron spectra; adhesion; atomic force microscopy; integrated circuit packaging; lead bonding; masks; moisture; plasma applications; plastic packaging; substrates; surface cleaning; surface contamination; AES; AFM characterization; Ar; Ar-H2; Au; Au traces; F; F traces; H2; O2; PBGA substrates; XPS; contact angle method; cross-contamination; moisture sensitivity; moulding compound adhesion; plasma cleaning; plasma induced surface modification; plasma parameters optimisation; plastic BGA; plastic ball grid array; solder mask adhesion; surface cleanliness; wedge bond quality; wedge pull test; wire bondability; Adhesives; Argon; Bonding; Cleaning; Electronics packaging; Optimization methods; Plasmas; Plastics; Testing; Wire;
Conference_Titel :
Physical & Failure Analysis of Integrated Circuits, 1997., Proceedings of the 1997 6th International Symposium on
Print_ISBN :
0-7803-3985-1
DOI :
10.1109/IPFA.1997.638120
