• DocumentCode
    2525904
  • Title

    Analytical solution for transient temperature distribution of semi -infinite body subjected to 3-D moving heat source of submerged Arc Welding process

  • Author

    Ghosh, Aniruddha ; Chattopadhyaya, Somnath

  • Author_Institution
    Dept. of Mech. Eng., Govt. Coll. of Eng. & Textile Technol., Berhampore, India
  • fYear
    2010
  • fDate
    10-12 Sept. 2010
  • Firstpage
    733
  • Lastpage
    737
  • Abstract
    Studies on temperature distribution during welding are very important because this may pave the way for application of microstructure modeling, thermal stress analysis, residual stress/distribution and welding process simulation. An attempt has been made in this paper to predict of temperature variation of entire plates during welding and after welding through an analytical solution is derived from the transient multi dimensional heat conduction of infinite plate to finite thickness. The heat input that is applied on the plate is exactly same amount of heat lost for electric arc is assumed to be a moving double central conicoidal heat source with Gaussian distribution for Submerged Arc Welding process. The prediction was compared with experimental results with generally good agreement.
  • Keywords
    Gaussian distribution; arc welding; heat conduction; plates (structures); temperature distribution; thermal analysis; thermal stresses; 3D moving heat source; Gaussian distribution; conicoidal heat source; electric arc; heat conduction; microstructure modeling; plates; residual stress-distribution; semiinfinite body; submerged arc welding; thermal stress analysis; transient temperature distribution; Heating; Solid lasers; Solids; Surface treatment; Welding; 3-D Gaussian heat distribution; Central Conicoidal heat source; Multi dimension heat flow equation; Numerical solution; Submerged Arc Welding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechanical and Electrical Technology (ICMET), 2010 2nd International Conference on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-8100-2
  • Electronic_ISBN
    978-1-4244-8102-6
  • Type

    conf

  • DOI
    10.1109/ICMET.2010.5598459
  • Filename
    5598459