Title :
Thermomechanical and electromigration studies with a high sensitive and high resolution laser probe
Author :
Dilhaire, S. ; Phan, T. ; Schaub, E. ; Claeys, W.
Author_Institution :
Centre de Phys. Moleculaire Optique et Hertzienne, Bordeaux I Univ., Talence, France
Abstract :
A high sensitive and high resolution laser probe devoted to the thermomechanical and electromigration studies of microelectronic interconnects has been developed. It provides information, at micrometric scale, on temperature increase and thermal stress which are directly related to electromigration failures of interconnects. The high sensitivity (5 mK and 0.1 picometer deformation) allows in situ characterisation and early detection of defaults
Keywords :
electromigration; failure analysis; integrated circuit interconnections; light interferometry; measurement by laser beam; thermal stresses; default detection; differential interferometer; electromigration failure; laser probe; microelectronic interconnect; thermal stress; thermomechanics; Electromigration; Integrated circuit interconnections; Laser beams; Laser theory; Optical interferometry; Optical polarization; Optical surface waves; Probes; Thermal stresses; Thermomechanical processes;
Conference_Titel :
Physical & Failure Analysis of Integrated Circuits, 1997., Proceedings of the 1997 6th International Symposium on
Print_ISBN :
0-7803-3985-1
DOI :
10.1109/IPFA.1997.638122
