Title :
Fully functional fine-grain vertically integrated 3D focal plane neuromorphic processor
Author :
Di Federico, M. ; Julian, P. ; Andreou, A.G. ; Mandolesi, P.S.
Author_Institution :
Dept. de Ing. Electr. y de Computadoras, Univ. Nac. del Sur, Bahia Blanca, Argentina
Abstract :
This paper presents the first fully functional fine-grain 3D vertically integrated focal plane system processor, implemented in the 3D interconnection technology of Tezzaron Semiconductors. The processor consists of an array of cells, auxiliar structures and general purpose blocks. The chip can acquire video and apply a series of image processing tasks to each frame employing local computation among cells. The chip has been successfully tested at 50Mhz.
Keywords :
image processing; integrated circuit interconnections; three-dimensional integrated circuits; 3D interconnection technology; auxiliar structures; cell array; focal plane neuromorphic processor; frequency 50 MHz; fully functional fine-grain vertical 3D integration; general purpose computation blocks; image processing tasks; Arrays; Conferences; Integrated circuit interconnections; Prototypes; Three-dimensional displays; 3D integration; focal plane processor;
Conference_Titel :
SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2014 IEEE
Conference_Location :
Millbrae, CA
DOI :
10.1109/S3S.2014.7028244
