Title :
Tamper Protection for Security Devices
Author :
Paul, Philip ; Moore, Simon ; Tam, Simon
Author_Institution :
Comput. Lab., Univ. of Cambridge, Cambridge
Abstract :
Organic electronic materials are proposed to be used as a tamper protection grid for hardware security modules. Methods of designing a protection grid likely to be damaged in currently published depackaging techniques are derived. Organic protection layers are shown to be a feasible method of protecting hardware security modules against tampering.
Keywords :
cryptography; electronics packaging; hardware security module; organic electronic materials; protection grid; security devices; tamper protection; Circuits; Computer security; Cryptography; Data security; Hardware; Laboratories; Monitoring; Packaging; Protection; Radiofrequency identification; OTFT; Organic Electronics; Security Devices; Smart Card; Tamper Protection;
Conference_Titel :
Bio-inspired Learning and Intelligent Systems for Security, 2008. BLISS '08. ECSIS Symposium on
Conference_Location :
Edinburgh
Print_ISBN :
978-0-7695-3265-3
DOI :
10.1109/BLISS.2008.27