• DocumentCode
    2526417
  • Title

    Tamper Protection for Security Devices

  • Author

    Paul, Philip ; Moore, Simon ; Tam, Simon

  • Author_Institution
    Comput. Lab., Univ. of Cambridge, Cambridge
  • fYear
    2008
  • fDate
    4-6 Aug. 2008
  • Firstpage
    92
  • Lastpage
    96
  • Abstract
    Organic electronic materials are proposed to be used as a tamper protection grid for hardware security modules. Methods of designing a protection grid likely to be damaged in currently published depackaging techniques are derived. Organic protection layers are shown to be a feasible method of protecting hardware security modules against tampering.
  • Keywords
    cryptography; electronics packaging; hardware security module; organic electronic materials; protection grid; security devices; tamper protection; Circuits; Computer security; Cryptography; Data security; Hardware; Laboratories; Monitoring; Packaging; Protection; Radiofrequency identification; OTFT; Organic Electronics; Security Devices; Smart Card; Tamper Protection;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Bio-inspired Learning and Intelligent Systems for Security, 2008. BLISS '08. ECSIS Symposium on
  • Conference_Location
    Edinburgh
  • Print_ISBN
    978-0-7695-3265-3
  • Type

    conf

  • DOI
    10.1109/BLISS.2008.27
  • Filename
    4595802
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2526417