• DocumentCode
    2526575
  • Title

    Are GaAs MOSFETs worth building? A model-based comparison of Si and GaAs n-MOSFETs

  • Author

    Fischetti, M.V. ; Laux, S.E.

  • Author_Institution
    IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
  • fYear
    1989
  • fDate
    3-6 Dec. 1989
  • Firstpage
    481
  • Lastpage
    484
  • Abstract
    A two-dimensional self-consistent Monte Carlo device modeling program is used to determine the behavior of submicron GaAs n-MOSFETs with semiconductor-insulator properties idealistically assumed to be of the same high caliber as present-day Si-SiO/sub 2/ interfaces. Compared to their conventional Si substrate counterparts, GaAs n-MOSFETs have similar transconductances and transit times, casting doubt on the notion that GaAs n-MOSFETs will ever outperform Si n-MOSFETs. Although alternative novel device designs better suited for exploiting the transport properties of bulk GaAs cannot be precluded, it is argued that the technological challenges of actually manufacturing GaAs devices further favor the use of silicon. These results can be predicted by considering the full semiconductor band structure away from the band extrema and suggest that differences among various semiconductors and carrier types are of diminishing importance for submicron devices.<>
  • Keywords
    III-V semiconductors; Monte Carlo methods; gallium arsenide; insulated gate field effect transistors; semiconductor device models; GaAs; GaAs devices; Si substrate; carrier types; model-based comparison; n-MOSFETs; n-channel; semiconductor band structure; semiconductor-insulator properties; submicron devices; transconductances; transit times; two-dimensional self-consistent Monte Carlo device modeling program; Casting; Conductors; Doping; Effective mass; Gallium arsenide; MOSFET circuits; Monte Carlo methods; Physics; Substrates; Transconductance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1989. IEDM '89. Technical Digest., International
  • Conference_Location
    Washington, DC, USA
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-0817-4
  • Type

    conf

  • DOI
    10.1109/IEDM.1989.74326
  • Filename
    74326