Title :
The study of adhesive performance within backside-via revealing
Author :
Li, H.Y. ; Ding, Lixin ; Lo, G.Q.
Author_Institution :
Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
Abstract :
BSR (back-side via revealing) of TSV wafers after temporary bonding is very critical process within 3D integration. Adhesive performances of the temporary bonding were inspected step by step within BSR process by IR inspection system. We found out the delamination happened after backside dielectric deposition at specific pattern. The delamination area and structure were inspected and reported in this paper.
Keywords :
adhesive bonding; delamination; inspection; three-dimensional integrated circuits; 3D integration; IR inspection system; TSV wafers; adhesive performance; backside dielectric deposition; backside-via revealing; delamination; temporary bonding; Bonding; Curing; Dielectrics; Inspection; Polymers; Silicon; Through-silicon vias;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th
Conference_Location :
Singapore
DOI :
10.1109/EPTC.2014.7028277
