DocumentCode
252667
Title
The study of adhesive performance within backside-via revealing
Author
Li, H.Y. ; Ding, Lixin ; Lo, G.Q.
Author_Institution
Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
fYear
2014
fDate
3-5 Dec. 2014
Firstpage
84
Lastpage
87
Abstract
BSR (back-side via revealing) of TSV wafers after temporary bonding is very critical process within 3D integration. Adhesive performances of the temporary bonding were inspected step by step within BSR process by IR inspection system. We found out the delamination happened after backside dielectric deposition at specific pattern. The delamination area and structure were inspected and reported in this paper.
Keywords
adhesive bonding; delamination; inspection; three-dimensional integrated circuits; 3D integration; IR inspection system; TSV wafers; adhesive performance; backside dielectric deposition; backside-via revealing; delamination; temporary bonding; Bonding; Curing; Dielectrics; Inspection; Polymers; Silicon; Through-silicon vias;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th
Conference_Location
Singapore
Type
conf
DOI
10.1109/EPTC.2014.7028277
Filename
7028277
Link To Document