Title :
Design of a folded-patch chip-size antenna for short-range communications
Author :
Mendes, P.M. ; Polyakov, A. ; Bartek, M. ; Burghartz, Joachim N. ; Correia, J.H.
Author_Institution :
Dept. of Ind. Electron., Minho Univ., Portugal
Abstract :
We report on design of an integrated folded shorted-patch (FSP) chip-size antenna for operation at 5.7 GHz and use in short-range wireless communications. Application of wafer-level chip-scale packaging (WLCSP) techniques like adhesive wafer bonding and through-wafer electrical via formation, combined with the selected antenna type allows antenna on-chip integration. The operating characteristics of a folded S-P antenna built on two stacked glass substrates were analysed with respect to substrate thickness, middle patch length and substrate sidewall angles. Antenna size reduction down to 4x4x1 mm3, efficiency of 66% and bandwidth of 62 MHz are predicted.
Keywords :
antennas; chip scale packaging; integrated circuit design; wafer bonding; wafer-scale integration; 5.7 GHz; 62 MHz; 66 percent; FSP; WLCSP; adhesive wafer bonding; antenna on-chip integration; chip-size antenna; folded S-P antenna; folded-patch antenna; middle patch length; short-range communications; stacked glass substrates; substrate sidewall angles; substrate thickness; through-wafer electrical via formation; wafer-level chip-scale packaging; wireless communications; Chip scale packaging; Dielectric substrates; Fabrication; Glass; Patch antennas; Prototypes; Silicon; Wafer bonding; Wafer scale integration; Wireless communication;
Conference_Titel :
Microwave Conference, 2003. 33rd European
Print_ISBN :
1-58053-834-7
DOI :
10.1109/EUMC.2003.1262992
