An X-band high power amplifier module package using selectively anodized aluminum substrate

In this paper, we made a high power amplifier module package using a selectively anodized aluminum substrate for the X-band radar T/R modules. The proposed solution of package is based on thick anodized aluminum oxide (Al₂O₃) layers and power chips mounted on aluminum for an effective heat sink. The fabricated high power amplifier module has a maximum output power of 39.49 dBm and maximum gain of 32 dB over 9-10 GHz frequency band. This package method can be further contributed to decreasing cost, reducing module size and managing thermal problem for the microwave high power T/R modules.