• DocumentCode
    252690
  • Title

    Picking large thinned dies with high topography on both sides

  • Author

    Gerets, C. ; Derakhshandeh, J. ; Teng Wang ; Capuz, G. ; Podpod, A. ; Demeurisse, C. ; Rebibis, K.J. ; Miller, A. ; Beyer, G. ; Beyne, E.

  • Author_Institution
    IMEC, Leuven, Belgium
  • fYear
    2014
  • fDate
    3-5 Dec. 2014
  • Firstpage
    175
  • Lastpage
    179
  • Abstract
    The process of picking large thinned dies, as a crucial step of the pre-assembly part in a 3D integration flow, has been investigated in this paper. Key factors affecting the yield of this process are identified to be the selection of correct collet material, the needle configuration, and ejection height. By combining correct tools and optimized process parameters, large 50 μm thick dies with dimensions up to 31.6×26 mm2 can be successfully picked. Cu and Sn micro-bumps on both sides of the thin dies are well preserved after the picking process.
  • Keywords
    copper; microassembling; three-dimensional integrated circuits; tin; wafer bonding; 3D integration flow; Cu; Sn; copper microbumps; ejection height; large thinned die picking process; needle configuration; tin microbumps; Conferences; Electronics packaging; Needles; Nickel; Surfaces; Three-dimensional displays; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th
  • Conference_Location
    Singapore
  • Type

    conf

  • DOI
    10.1109/EPTC.2014.7028289
  • Filename
    7028289
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=252690