DocumentCode
2526902
Title
Semiconductor manufacturing process monitoring using built-in self-test for embedded memories
Author
Schanstra, Ivo ; Lukita, Dharmajaya ; Van de Goor, Ad J. ; Veelenturf, Kees ; Van Wijnen, Paul J.
Author_Institution
Philips Semicond., Nijmegen, Netherlands
fYear
1998
fDate
18-23 Oct 1998
Firstpage
872
Lastpage
881
Abstract
Memories are often used as a semiconductor manufacturing process monitoring vehicle. This paper describes a new memory built-in self-test (BIST) method that is used to monitor the semiconductor manufacturing process. For this purpose, this BIST method has the ability not only to generate a pass/fail verdict for the tested memory, but also to report additional information to be able to narrow down the type and the location of the failure mode that is causing the tested memory to fail. Also, it offers test algorithm flexibility. The described BIST method has successfully been implemented in a dedicated process monitoring chip that is now being used in large quantities
Keywords
built-in self test; embedded systems; fault diagnosis; integrated circuit manufacture; integrated memory circuits; process monitoring; random-access storage; built-in self-test; dedicated process monitoring chip; embedded memories; failure mode; pass/fail verdict; semiconductor manufacturing process monitoring; test algorithm flexibility; Application specific integrated circuits; Built-in self-test; Condition monitoring; Fault diagnosis; Feedback; Manufacturing processes; Random access memory; Read-write memory; Testing; Vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1998. Proceedings., International
Conference_Location
Washington, DC
ISSN
1089-3539
Print_ISBN
0-7803-5093-6
Type
conf
DOI
10.1109/TEST.1998.743277
Filename
743277
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