Highly efficient packaging processes by reactive multilayer materials for die-attach in power electronic applications

In the field of power electronics, assembly and interconnection technologies play an important role for the design of modules and systems. The applied packaging technologies largely determine the electrical, thermal, and mechanical properties of the final module. In addition to conventional solder technology upcoming technologies like sintering, transient liquid phase soldering or adhesive bonding are interesting methods for the realization of the semiconductor die attach. However, all these technologies imply a costly and time-consuming process chain. An innovative alternative for die attach is represented by reactive multilayer foils, which are a class of nano-engineered materials, to realize the interconnection to the substrate. By applying reactive multilayers for interconnection of electronic components on circuit carriers there is an immense potential to shorten and simplify the process chain of assembly significantly. For example, solder paste printing processes and time-consuming reflow soldering or sintering processes can be completely eliminated. The aim is to realize the application process highly efficient with standard equipment. Therefore a completely integrated placement process is provided. However, an adequately qualification of the reactive multilayer foil as interconnection medium is necessary. From there the mechanical properties of the resulting joints are characterized in this paper.