• DocumentCode
    252716
  • Title

    Achievement of a high-sensitive and high-overload sensor based on the bossed-diaphragm structure

  • Author

    Zhongliang Yu ; Yulong Zhao ; Lili Li ; Cun Li ; Guanwu Zhou ; Bian Tian

  • Author_Institution
    State Key Lab. for Manuf. Syst. Eng., Xi´an Jiaotong Univ., Xi´an, China
  • fYear
    2014
  • fDate
    13-16 April 2014
  • Firstpage
    186
  • Lastpage
    190
  • Abstract
    The paper presents a piezoresistive absolute micro-pressure sensor for altimetry. This investigation includes the design, fabrication and testing of the sensor. An improved structure is studied through incorporating sensitive beams into the bossed-diaphragm structure. By analyzing the stress distribution of sensitive elements using finite element method (FEM), the configuration shows an enhanced sensitivity and a proper overload resistance. Equations about surface stress and deflection of the sensor are established by multivariate fittings based on ANSYS loop calculation results. Structure dimensions are optimized and determined by MATLAB. Silicon bulk micromachining technology is utilized to fabricate the sensor prototype, and the processing is discussed. The outputs under both static and dynamic conditions are tested. Experimental results demonstrate the sensor features a relatively high sensitivity of 11.655 μV/V/Pa in the operating range of 500 Pa at room temperature and a proper overload resistance of 200 times overpressure to promise its survival under atmosphere. The favorable performances enable the sensor´s application in measuring absolute micro pressure.
  • Keywords
    computerised instrumentation; diaphragms; elemental semiconductors; finite element analysis; height measurement; mathematics computing; micromachining; microsensors; piezoresistive devices; pressure measurement; pressure sensors; silicon; stress measurement; ANSYS loop calculation; FEM; MATLAB; absolute micropressure measurement; altimetry; bossed-diaphragm structure; deflection equation; finite element method; microfabrication; multivariate fitting; piezoresistive absolute micropressure sensor; pressure 500 Pa; sensitive beam; silicon bulk micromachining technology; surface stress equation; temperature 293 K to 298 K; Finite element analysis; Pressure measurement; Resistance; Sensitivity; Silicon; Stress; Temperature measurement; MEMS; Piezoresistive; high-overload; high-sensitive; micro-pressure;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems (NEMS), 2014 9th IEEE International Conference on
  • Conference_Location
    Waikiki Beach, HI
  • Type

    conf

  • DOI
    10.1109/NEMS.2014.6908787
  • Filename
    6908787