DocumentCode
2527260
Title
Micromechanical resonators for frequency references and signal processing
Author
Howe, R.T. ; Nguyen, C.T.-C.
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
fYear
1994
fDate
11-14 Dec. 1994
Firstpage
343
Abstract
Summary form only given, as follows. This paper reviews the application of silicon micromachining to the fabrication of electrostatically driven and capacitively sensed micromechanical resonators. These structures can be surface-micromachined from polysilicon and also, from single crystal silicon using wafer bonding and etch-back, with both technologies compatible with integration of drive and sense CMOS electronics. The potential applications of these structures to integrated frequency references, micromechanical filters and mixers are described. The passband characteristics of these resonators can be adjusted electrically. Integrated micro-ovens for temperature control have been demonstrated, as well. Finally, we assess the frequency range and prospects for micromechanical signal processing.<>
Keywords
electrostatic devices; elemental semiconductors; etching; micromachining; micromechanical resonators; silicon; wafer bonding; CMOS electronics; Si; capacitive sensing; electrostatic drive; etch-back; frequency range; frequency references; integrated micro-ovens; micromechanical filters; micromechanical resonators; micromechanical signal processing; mixers; passband characteristics; polysilicon; silicon micromachining; temperature control; wafer bonding; CMOS technology; Etching; Fabrication; Micromachining; Micromechanical devices; Passband; Resonant frequency; Resonator filters; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1994. IEDM '94. Technical Digest., International
Conference_Location
San Francisco, CA, USA
ISSN
0163-1918
Print_ISBN
0-7803-2111-1
Type
conf
DOI
10.1109/IEDM.1994.383398
Filename
383398
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