• DocumentCode
    2527260
  • Title

    Micromechanical resonators for frequency references and signal processing

  • Author

    Howe, R.T. ; Nguyen, C.T.-C.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
  • fYear
    1994
  • fDate
    11-14 Dec. 1994
  • Firstpage
    343
  • Abstract
    Summary form only given, as follows. This paper reviews the application of silicon micromachining to the fabrication of electrostatically driven and capacitively sensed micromechanical resonators. These structures can be surface-micromachined from polysilicon and also, from single crystal silicon using wafer bonding and etch-back, with both technologies compatible with integration of drive and sense CMOS electronics. The potential applications of these structures to integrated frequency references, micromechanical filters and mixers are described. The passband characteristics of these resonators can be adjusted electrically. Integrated micro-ovens for temperature control have been demonstrated, as well. Finally, we assess the frequency range and prospects for micromechanical signal processing.<>
  • Keywords
    electrostatic devices; elemental semiconductors; etching; micromachining; micromechanical resonators; silicon; wafer bonding; CMOS electronics; Si; capacitive sensing; electrostatic drive; etch-back; frequency range; frequency references; integrated micro-ovens; micromechanical filters; micromechanical resonators; micromechanical signal processing; mixers; passband characteristics; polysilicon; silicon micromachining; temperature control; wafer bonding; CMOS technology; Etching; Fabrication; Micromachining; Micromechanical devices; Passband; Resonant frequency; Resonator filters; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1994. IEDM '94. Technical Digest., International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-2111-1
  • Type

    conf

  • DOI
    10.1109/IEDM.1994.383398
  • Filename
    383398