• DocumentCode
    252732
  • Title

    Simultaneously obtaining the Young´s relaxation modulus and shear relaxation modulus of an epoxy molding compound by using DMA

  • Author

    Dao-Long Chen ; Tz-Cheng Chiu ; Tei-Chen Chen ; Ping-Feng Yang ; Chih-Pin Hung ; Jen-Kuang Fang

  • Author_Institution
    Corp. R&D, Adv. Semicond. Eng., Inc., Kaohsiung, Taiwan
  • fYear
    2014
  • fDate
    3-5 Dec. 2014
  • Firstpage
    171
  • Lastpage
    174
  • Abstract
    In this work, a methodology is developed for obtaining the Young´s relaxation modulus and shear relaxation modulus simultaneously by using a single dynamic mechanical analysis (DMA) experiment. The bulk modulus is assumed as a constant and calculated by Poisson´s ratio. The modulating Young´s moduli and characteristic times that measured by DMA are corrected analytically by using the developed formulas. The shear relaxation modulus is then obtained from the corrected modulating Young´s moduli and the constant bulk modulus. As a demonstration of the methodology, it is applied to the DMA measurement of an epoxy molding compound (EMC).
  • Keywords
    Young´s modulus; moulding; stochastic processes; DMA measurement; EMC; Poisson ratio; Young moduli; Young relaxation modulus; bulk modulus; characteristic times; epoxy molding compound; shear relaxation modulus; single dynamic mechanical analysis; Compounds; Electromagnetic compatibility; Plastics; Reliability; Semiconductor device measurement; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th
  • Conference_Location
    Singapore
  • Type

    conf

  • DOI
    10.1109/EPTC.2014.7028313
  • Filename
    7028313