Title :
Simultaneously obtaining the Young´s relaxation modulus and shear relaxation modulus of an epoxy molding compound by using DMA
Author :
Dao-Long Chen ; Tz-Cheng Chiu ; Tei-Chen Chen ; Ping-Feng Yang ; Chih-Pin Hung ; Jen-Kuang Fang
Author_Institution :
Corp. R&D, Adv. Semicond. Eng., Inc., Kaohsiung, Taiwan
Abstract :
In this work, a methodology is developed for obtaining the Young´s relaxation modulus and shear relaxation modulus simultaneously by using a single dynamic mechanical analysis (DMA) experiment. The bulk modulus is assumed as a constant and calculated by Poisson´s ratio. The modulating Young´s moduli and characteristic times that measured by DMA are corrected analytically by using the developed formulas. The shear relaxation modulus is then obtained from the corrected modulating Young´s moduli and the constant bulk modulus. As a demonstration of the methodology, it is applied to the DMA measurement of an epoxy molding compound (EMC).
Keywords :
Young´s modulus; moulding; stochastic processes; DMA measurement; EMC; Poisson ratio; Young moduli; Young relaxation modulus; bulk modulus; characteristic times; epoxy molding compound; shear relaxation modulus; single dynamic mechanical analysis; Compounds; Electromagnetic compatibility; Plastics; Reliability; Semiconductor device measurement; Temperature measurement;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th
Conference_Location :
Singapore
DOI :
10.1109/EPTC.2014.7028313