Title :
Effect of temperature on tensile properties of high-melting point Bi system solder
Author :
Haidong Zhang ; Shohji, I. ; Shimoda, M. ; Watanabe, H.
Author_Institution :
Fac. of Sci. & Technol., Gunma Univ., Kiryu, Japan
Abstract :
Tensile properties of three Bi-bearing lead-free solder were investigated and compared with that of Pb-rich Pb-2.5Ag-2.5Sn (mass%) solder. Tensile strength decreases with increasing temperature in all solder investigated. Although tensile strength of Bi-bearing solder is lower than that of Pb-2.5Ag-2.5Sn at 25°C, tensile strength of Bi-1.0Ag-0.3Sn-0.03Ge (mass%) and Bi-2.5Ag (mass%) are analogous to and higher than that of Pb-2.5Ag-2.5Sn respectively at a temperature of 125°C or more. 0.2% proof stress of Bi-2.5Ag increases with increasing temperature. Although the proof stress of Bi-2.5Ag is the lowest at 25°C, it was the highest at 125°C and 175°C among solder investigated. Elongation of Bi-bearing lead-free solder improves with increasing temperature. In particular, the improvement of elongation of Bi is significant and it improves up to approximately 60 % at a temperature of 125°C or more.
Keywords :
bismuth; bismuth alloys; elongation; germanium alloys; internal stresses; lead alloys; silver alloys; solders; tensile strength; tin alloys; Bi; Bi-Ag; Bi-Ag-Sn-Ge; Bi-bearing lead-free solder; Pb-Ag-Sn; elongation; high-melting point Bi system solder; proof stress; temperature 25 degC to 175 degC; temperature effect; tensile properties; tensile strength; Bismuth; Lead; Microstructure; Stress; Surface cracks; Temperature;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th
Conference_Location :
Singapore
DOI :
10.1109/EPTC.2014.7028316
