Title :
Mechanical properties of low-silver Sn-1.0Ag-0.7Cu-1.6Bi-0.2In solder
Author :
Takahashi, Y. ; Shohji, I.
Author_Institution :
Fac. of Sci. & Technol., Gunma Univ., Kiryu, Japan
Abstract :
Tensile and fatigue properties of low-Ag lead-free Sn-1.0Ag-0.7Cu-1.6Bi-0.2In (mass%) solder were investigated with miniature size specimens. The obtained data were compared with those of Sn-3.0Ag-0.5Cu (mass%). Tensile strength and 0.1% proof stress of Sn-1.0Ag-0.7Cu-1.6Bi-0.2In are higher than those of Sn-3.0Ag-0.5Cu regardless of strain rate and temperature investigated. Although elongation of Sn-1.0Ag-0.7Cu-1.6Bi-0.2In is inferior to that of Sn-3.0Ag-0.5Cu at 25°C and 80°C, this trend is reversed at 120°C. Fatigue properties of Sn-1.0Ag-0.7Cu-1.6Bi-0.2In scarcely changes at 25°C and 125°C. Although fatigue life of Sn-1.0Ag-0.7Cu-1.6Bi-0.2In is inferior to that of Sn-3.0Ag-0.5Cu at 25°C, fatigue lives of both solder are at the same level at 125°C.
Keywords :
bismuth alloys; copper alloys; elongation; fatigue; indium alloys; silver alloys; solders; tensile strength; tin alloys; SnAgCuBiIn; elongation; fatigue life; low-silver lead-free solder; temperature 120 degC; temperature 25 degC; temperature 80 degC; tensile strength; Fatigue; Lead; Materials; Strain; Stress; Surface cracks; Temperature;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th
Conference_Location :
Singapore
DOI :
10.1109/EPTC.2014.7028317
