DocumentCode
252746
Title
Alternative flip chip sample preparation technique using triple ion beam milling
Author
Qiu, W. ; Zee, B. ; Foo, F.J. ; Grunewald, W.
Author_Institution
Device Anal. Lab., Adv. Micro Devices Pte Ltd., Singapore, Singapore
fYear
2014
fDate
3-5 Dec. 2014
Firstpage
587
Lastpage
591
Abstract
This paper describes an alternative cross-section sample preparation approach using triple ion beam (TIB) milling to prepare flip chip samples. The 3 cases study results clearly demonstrate the capability and advantages of TIB milling for preparing Lead-free and eutectic C4 solder bumps and back-end-of-line (BEOL) defects as compared to conventional mechanical and Focus Ion Beam (FIB) cross-section.
Keywords
failure analysis; flip-chip devices; focused ion beam technology; solders; back-end-of-line defects; cross-section sample preparation; eutectic C4 solder bumps; flip chip sample preparation technique; focus ion beam cross-section; lead-free solder bumps; triple ion beam milling; Cooling; Failure analysis; Flip-chip devices; Ion beams; Materials; Milling; Scanning electron microscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th
Conference_Location
Singapore
Type
conf
DOI
10.1109/EPTC.2014.7028320
Filename
7028320
Link To Document