Title :
Alternative flip chip sample preparation technique using triple ion beam milling
Author :
Qiu, W. ; Zee, B. ; Foo, F.J. ; Grunewald, W.
Author_Institution :
Device Anal. Lab., Adv. Micro Devices Pte Ltd., Singapore, Singapore
Abstract :
This paper describes an alternative cross-section sample preparation approach using triple ion beam (TIB) milling to prepare flip chip samples. The 3 cases study results clearly demonstrate the capability and advantages of TIB milling for preparing Lead-free and eutectic C4 solder bumps and back-end-of-line (BEOL) defects as compared to conventional mechanical and Focus Ion Beam (FIB) cross-section.
Keywords :
failure analysis; flip-chip devices; focused ion beam technology; solders; back-end-of-line defects; cross-section sample preparation; eutectic C4 solder bumps; flip chip sample preparation technique; focus ion beam cross-section; lead-free solder bumps; triple ion beam milling; Cooling; Failure analysis; Flip-chip devices; Ion beams; Materials; Milling; Scanning electron microscopy;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th
Conference_Location :
Singapore
DOI :
10.1109/EPTC.2014.7028320
