DocumentCode :
2527472
Title :
Failure mechanisms of flash cell in program/erase cycling
Author :
Cappelletti, P. ; Bez, R. ; Cantarelli, D. ; Fratin, L.
Author_Institution :
Central Res. & Dev., SGS-Thomson Microelectron., Agrate Brianza, Italy
fYear :
1994
fDate :
11-14 Dec. 1994
Firstpage :
291
Lastpage :
294
Abstract :
The impact of program/erase cycling on flash memory cell is reviewed considering both performance degradation of the typical bit and the evolution of the erase threshold voltage distribution of the whole memory array. Emphasis is given to the failure mechanisms which affect flash memory endurance: the erratic erase phenomenon is discussed with reference to the model recently reported in the literature and a new degradation mechanism, induced by parasitic drain stress conditions in program/erase cycling, is presented.<>
Keywords :
EPROM; failure analysis; integrated circuit reliability; integrated memory circuits; voltage distribution; EEPROM; erase threshold voltage distribution; erratic erase phenomenon; failure mechanisms; flash cell; flash memory endurance; memory array; model; parasitic drain stress conditions; performance degradation; program/erase cycling; Channel hot electron injection; Degradation; Failure analysis; Flash memory; Probability distribution; Pulse measurements; Tail; Testing; Threshold voltage; Tunneling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1994. IEDM '94. Technical Digest., International
Conference_Location :
San Francisco, CA, USA
ISSN :
0163-1918
Print_ISBN :
0-7803-2111-1
Type :
conf
DOI :
10.1109/IEDM.1994.383410
Filename :
383410
Link To Document :
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