• DocumentCode
    252759
  • Title

    Biocompatible packaging for implantable miniaturized pressure sensor device used for stent grafts: Concept and choice of materials

  • Author

    Kirsten, Sabine ; Schubert, Martin ; Braunschweig, Markus ; Woldt, Gregor ; Voitsekhivska, Tetiana ; Wolter, Klaus-Jurgen

  • Author_Institution
    Electron. Packaging Lab., Tech. Univ. Dresden, Dresden, Germany
  • fYear
    2014
  • fDate
    3-5 Dec. 2014
  • Firstpage
    719
  • Lastpage
    724
  • Abstract
    This paper presents the biocompatible packaging technology of a flexible, miniaturized and wireless pressure sensor device which is connected to a stent graft to monitor the pressure distribution within an aneurysm. The packaging of implantable electronic devices has to comply with several requirements regarding their reliability and biocompatibility especially for long term implants. Building up a miniaturized flexible pressure sensor device consisting of four capacitive pressure sensors, an application-specific integrated circuit (ASIC) and passive components for the wireless data transmission and power consumption requires polymers as substrate and encapsulation materials. Under the stated conditions, polymeric materials as polyimide, silicones, epoxy resins and parylene C are investigated with respect to their barrier properties (ion and water vapor permeability) and their adhesive strength towards each other.
  • Keywords
    application specific integrated circuits; biosensors; encapsulation; flexible electronics; polymers; pressure sensors; stents; substrates; ASIC; adhesive strength; aneurysm; application-specific integrated circuit; barrier property; biocompatible packaging technology; encapsulation material; epoxy resin; implantable electronic device; implantable miniaturized flexible pressure sensor device; parylene C; passive component; polyimide; polymer substrate; power consumption; pressure distribution monitor; silicone; stent graft; wireless data transmission; wireless pressure sensor device; Aneurysm; Encapsulation; Epoxy resins; Polyimides; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th
  • Conference_Location
    Singapore
  • Type

    conf

  • DOI
    10.1109/EPTC.2014.7028327
  • Filename
    7028327